Corrosion and Protection Methods of Sn-Based Solders

Since the worldwide prohibition of traditional Pb-Sn eutectic solders at the beginning of 21st century, series of Pb-free Sn-based solders have been developed via elements alloying and nano-particles addition. Whilst the mechanical properties of solder alloys can be effectively improved through alloying and/or structures refinement, improving their corrosion resistance is a different story, which involves the structures, composition, and especially the characteristics of surface oxides film. In addition, the electrochemical interactions and mechanisms between solder and the environment in which it is used have not been fully understood and need to be clarified. Besides, the anti-corrosion treatments of circuit boards or solder joints, such as coatings or other measures, are urgently needed by engineers.

This Research Topics entitled Corrosion and Protection Methods of Sn-based Solders is focused on current trends in corrosion science, engineering, and technology and aims to provide a communication platform for researchers from all over the world working on the corrosion of Pb-free Sn-based solder alloys and the protection of circuit board and/or solder joints. Corrosion studies of solder alloys include the design and development of corrosion-resistant solder alloys through elements alloying, nano-particles addition and surface oxides film fabrication, as well as the corrosion behavior of solders under effect of different variables are also welcome. Protection of circuit board and/or solder joints refers to the corrosion degradation and electrochemical migration mechanisms, as well as the corresponding protection measures, such as the surface coating treatment and corrosion monitoring sensors. Experimental and simulating methods and other related issues are also within the scope of this Research Topic. Relevant review papers are also of interest.

We invite researchers to submit theoretical and experimental original research articles as well as mini and full reviews related to (but not limited to) the following topics:
• Pb-free Sn-based solders;
• Solder joint and/or circuit board;
• Corrosion resistant solders;
• Element alloying;
• Nano-particle addition;
• Structure refinement;
• Surface oxides film fabrication;
• Galvanic corrosion;
• Electrochemical migration;
• Degradation mechanism;
• Corrosion protections and monitoring;
• Advanced characterizations for corrosion mechanisms studies.

Keywords: Pb-free Sn-based solders, Corrosion resistance, Element alloying, Nano-particle addition, Structure refinement, Surface oxides film, Galvanic corrosion, Electrochemical migration, Degradation mechanism, Corrosion protection, Corrosion monitoring

Important Note: All contributions to this Research Topic must be within the scope of the section and journal to which they are submitted, as defined in their mission statements. Frontiers reserves the right to guide an out-of-scope manuscript to a more suitable section or journal at any stage of peer review.